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Business Wire IndiaSnom Technology, the leading developer of professional and business IP Telephones, is proud to announce that they are now members of the ‘TeleTrusT Association of Germany’. Snom strives to achieve perfection…
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Business Wire IndiaWipro Limited (NYSE:WIT, BSE: 507685, NSE: WIPRO), a leading global information technology, consulting and business process services company today announced a partnership with Mountain View based Authentise Inc, a leading…
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Business Wire IndiaItalian firm Comiflex SRL has shaken hands with India’s largest global flexible packaging solution company Uflex Limited confirming its intent to manufacture Gearless C.I. Flexo Printing Machines under a Technology…
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Business Wire IndiaPolycom was named the ‘Video Conferencing Equipment Vendor of the Year’, at the 2016 Frost & Sullivan India ICT Awards banquet held on June 2nd at Hyatt Regency, Mumbai. Polycom has been growing…
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Business Wire IndiaToday Ascensia Diabetes Care announced that it has renewed its global alliance with Medtronic plc to develop and market innovative diabetes management solutions for patients worldwide. As part of the agreement, Ascensia…
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Business Wire IndiaAmplus Energy Solutions Private Limited (“Amplus”), a portfolio company of I Squared Capital and one of India’s leading solar developers, has been selected for the National Award for Rooftop Project…
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Business Wire IndiaBERTIN, a brand of CNIM Group, is pleased to present its new FusionSight® Night Vision Device during Eurosatory 2016, held from June 13 to 17 in Paris, France. Developed in partnership with PHOTONIS, FusionSight®…
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Business Wire IndiaCyfuture, a leading provider of data center, cloud and outsourced support services announced plans to build a new data center facility in Noida with an initial investment of INR 50 crores (approx. USD 8 million). This new…
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Business Wire IndiaPower Integrations (Nasdaq: POWI), the leader in high-efficiency, high-reliability LED driver ICs, announced its LYTSwitch™-1 single-stage, non-isolated, buck topology LED driver IC family. Featuring a very…
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Business Wire IndiaPanasonic Corporation announced that it has developed a sheet-form encapsulation material (CV2008 series) for coreless package substrates that enables thinner-profile and lower-cost semiconductor packages. The sheet-form…
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