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Business Wire India Attractive price range of INR 2,38,900 –3,34,399 lakh, ex-showroom, Delhi Offers 5 colors, 5 variants with 5 different customization packages Promises most competitive Cost of Ownership in the…
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Business Wire IndiaPolycom was named the ‘Video Conferencing Equipment Vendor of the Year’, at the 2016 Frost & Sullivan India ICT Awards banquet held on June 2nd at Hyatt Regency, Mumbai. Polycom has been growing…
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Business Wire IndiaWipro Limited (NYSE:WIT, BSE: 507685, NSE: WIPRO), a leading global information technology, consulting and business process services company today announced a partnership with Mountain View based Authentise Inc, a leading…
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Business Wire IndiaAndersen Global is pleased to announce that we are now collaborating with SdM Chartered Professional Accountants, Inc. in Canada. SdM is the first of several firms that are expected to take this initial step toward a more…
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Business Wire IndiaThe Patient Safety Movement announced today that for the 2nd year in a row, former President Carter is demonstrating his support for the Movement’s goal of zero preventable deaths by 2020 by offering an opportunity…
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Business Wire IndiaFortinet, a key vendor in high-performance cyber security solutions, was named the ‘Network Security Vendor of the Year’ at the 2016 Frost & Sullivan India ICT Awards banquet held on June 2, at Hyatt…
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Business Wire IndiaThe success story of real estate is co-authored by different segments of real estate located within the same real estate hub. The integrated township, Hiranandani Gardens, Powai; which recently celebrated its silver…
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Business Wire IndiaSamsung Bioepis Co., Ltd. announced new clinical data on its anti-TNF-α portfolio of Benepali® (etanercept), Flixabi® (infliximab) and SB5 (adalimumab) investigational biosimilar candidate. The data will be…
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Business Wire IndiaPower Integrations (Nasdaq: POWI), the leader in high-efficiency, high-reliability LED driver ICs, announced its LYTSwitch™-1 single-stage, non-isolated, buck topology LED driver IC family. Featuring a very…
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Business Wire IndiaPanasonic Corporation announced that it has developed a sheet-form encapsulation material (CV2008 series) for coreless package substrates that enables thinner-profile and lower-cost semiconductor packages. The sheet-form…
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