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Business Wire IndiaMasimo (NASDAQ: MASI) announced the full market release outside the U.S. of the Pronto® Pulse CO-Oximeter® with Next Generation SpHb® Spot Check technology. Next Generation Pronto features rainbow…
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Business Wire IndiaPolycom was named the ‘Video Conferencing Equipment Vendor of the Year’, at the 2016 Frost & Sullivan India ICT Awards banquet held on June 2nd at Hyatt Regency, Mumbai. Polycom has been growing…
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Business Wire IndiaHewlett Packard Enterprise (NYSE: HPE) today announced the launch of the HPE Verity suite, a modular, integrated set of applications and services to help businesses comprehensively manage, govern and extract actionable…
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Business Wire IndiaEmbassy Group, India’s leading real estate developer today announced the launch of Embassy Springs, Bengaluru’s largest masterplanned city, within the silicon valley of India. Spread across 300 acres in North…
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Business Wire IndiaSingapore-based A. Menarini Asia-Pacific Holdings Pte Ltd (“Menarini Asia-Pacific”) and MSD have embarked on a multi-year partnership for Menarini Asia-Pacific to assume the sales, marketing and distribution…
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Business Wire IndiaAndersen Global is pleased to announce that we are now collaborating with SdM Chartered Professional Accountants, Inc. in Canada. SdM is the first of several firms that are expected to take this initial step toward a more…
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Business Wire IndiaWaldorf Astoria Hotels & Resorts, Hilton Worldwide‘s (NYSE:HLT) luxury brand of iconic landmark hotels, announced the signing of a management agreement with Ward Holdings to open a property in the Middle…
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Business Wire IndiaHilton Worldwide (NYSE: HLT) reinforced its commitment to the environment by announcing multi-year sustainable seafood goals on World Oceans Day. In collaboration with World Wildlife Fund (WWF), Hilton has committed to…
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Business Wire IndiaYASH Technologies™, a leading technology services and outsourcing partner for global companies, today announced it has achieved the ISO 27001:2013 Information Security Management System (ISMS) Standard for IT…
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Business Wire IndiaPanasonic Corporation announced that it has developed a sheet-form encapsulation material (CV2008 series) for coreless package substrates that enables thinner-profile and lower-cost semiconductor packages. The sheet-form…
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